| 摘要 |
PURPOSE:To bring lamination void to null and improve the moldability and dimensional accuracy of laminates by a method wherein laminates are formed by pilling up inner layer base materials, outer layer base materials and prepregs and the resultant laminates are capped with a vacuum frame so as to form a sealed body in order to evacuate the interior of the sealed body and, after that, to pour heated inert gas in an autoclave to heat the laminates and to apply pressure to the laminates only in the vertical direction. CONSTITUTION:A bottom force 3a is seated on the top surface of a carrier plate 2 installed on a sub-table 5 having an evacuating port 5a. Next, the laminates 1 of multilayer boards consisting of a plurality of inner layer base materials, outer layer base materials and prepregs are seated on the bottom force 3a and a top force 3b is put on the laminates. A square vacuum frame 4, which covers the top surface and side surfaces of the assembly of the laminates 1 and the top and the bottom forces 3b and 3a and the bottom of which is open, is seated on the carrier plate 2. The vacuum frame 4 is covered by a heat resisting bag film 8 so as to form a sealed body. Next, after the interior of the heat resisting bag 8 placed in an autoclave 9 is evacuated so as to produce a vacuum therein, heated inert gas is poured in the autoclave 9 so as to pressurize the top force 3b through an aluminum plate 10 from above in order to integrate the laminates to obtain multilayer printed circuit boards with no lamination void. |
