发明名称 RESIN SEALING DEVICE
摘要 PURPOSE:To prevent the occurrence of a void in the resin of a product by projecting the central part of a plunger further outward than its peripheral part. CONSTITUTION:In the resin sealing device 10 having a plunger for pushing resin which allows the resin to flow into a resin sealing mold 9, the plunger 1 is constructed in such a shape that the central part 12 of the resin contact surface 3 projects more outward than its peripheral part 13. Therefore, when the resin is pushed, it touches the central part 12 first and then touches the peripheral part 13, whereby air is caused to easily escape, and the product having no void in the resin part may be obtained. The length of the cylindrical part 7 of a head part 2 is shortened, and then the abrasion and the breakage in the sliding of the plunger 1 are reduced. If a spherical depression is formed correspondingly to the resin contact surface 3 of the head part 2 at the cull part 8 of a bottom force 5, the volume of useless resin is decreased, the curing time is shortened and the resin sealing process can be made more effective.
申请公布号 JPS63111021(A) 申请公布日期 1988.05.16
申请号 JP19860257294 申请日期 1986.10.29
申请人 SONY CORP 发明人 TAKAHASHI HIDEYUKI
分类号 B29C45/02;B29C45/14;B29C45/58;B29L31/34;H01L21/56 主分类号 B29C45/02
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