| 摘要 |
PURPOSE:To improve the reliability of mounting on a board by a method wherein the parts of a film where leads to which a chip is connected are formed are utilized as lead fixing elements and the deformation of the leads is avoided by the lead fixing elements. CONSTITUTION:Various through-holes 11... are punched in a stripe-shape film 10 made of polyimide or glass-epoxy. After the punching process, a stripe-shape copper foil 12 is bonded to the center part of the film 10. Then the copper foil 12 is etched to form leads 13... and solder plating is applied. Then a chip 14 which is a semiconductor element is electrically connected to the leads 13... by compression bonding or wire bonding and the chip 14 is sealed with synthetic resin 15. After the potting process, the film 10 on which the chip 14 is mounted is dried and punched at the positions shown by broken lines to the direction shown by arrows 16. Therefore, after the punching, a semiconductor device S in which lead fixing pieces 17 and 17 which are the fragments of the linear film 10 which makes a right angle with the longitudinal direction of the leads 13... are left under the tips of the leads 13... can be obtained.
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