| 摘要 |
PURPOSE:To facilitate connection of a lead to a drive circuit substrate and improve efficiency of an assembly process by providing a through hole group that is facing the through hole group of a light emission element wiring board at a peripheral part of the drive circuit board as well as a notch which permits these through holes to be opened at the peripheral part of the board. CONSTITUTION:A drive circuit substrate 11 is equipped with a notch 12a that permits a through hole 12 located at a peripheral part of a substrate 11 to be opened at the peripheral part of the broad 11 and forms a U-shaped notch from the periphery face of the drive circuit board in the inner direction. Accordingly, when a jumper lead 103a of a LED is inserted into the above notch, it is facilitated to pass through from the side direction. The lead of the LED is, for example, an iron series alloy of 0.5 mm in diameter and the surface of it is coated with solder. As a result, if the notch is made up to have its width of 0.8 mm, the lead can be freely inserted into notch or freely pass through it from the side direction. Thus, the lead part can be surely connected with solder 13. |
