| 摘要 |
PURPOSE:To remove projections from a semiconductor substrate without damaging the surface of the substrate nor leaving pulverized pieces thereon by approaching a rotary wing to the substrate while applying air pressure in the state that the substrate is mounted on a carriage, and removing projections on the substrate by the rotating blade on the surface parallel to the substrate surface. CONSTITUTION:A semiconductor substrate 1 is mounted on the upper surface of a carriage 3 in the state that a rotary wing 4 is sufficiently separated above from the carriage 3, and the wing 4 is rotated to feed air 10 from above to the substrate 1. Then, the wing 4 is moved downward to remove a projection 2 on the substrate 1 by the blade 5 of the rotary wing 4. In this case, the projection 2 is cut by the blade 5 to be elastically flown at the moment that the surface formed by the side 7 of the blade 5 of the carriage 3 side is contacted with the projection 2 by the rotation of the wing 4, but even if the pulverized piece 11 of the projection 2 is dropped on the substrate 1, the piece 11 is externally flown out from the substrate 1 by the air pressure of the wing 4. Thus, it can prevent the substrate from being damaged due to the piece of the projection and the piece from being adhered to the substrate.
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