| 摘要 |
PURPOSE:To remove the occurrence of air bubbles and holes inside insulating resin and to improve the insulating performance of a device in such a way that the holes produced the resin are covered with the insulating resign while the molded resin is being heated. CONSTITUTION:A radiating fin 3, where a support is installed at the side facing an electrode lead terminal 4, is fixed to a metal mold by means of the support and is molded; by keeping the state that molded resin 1 is being heated, insulating resin 6 is coated into a hole which is produced by tearing off the support inside the molded resin 1. The heating temperature of the molded resin is sufficient at 50 deg.C; this heating operation can be executed by means of a simple hot plate, a hot-air heater or the like. Because the insulating resin is coated into the hole produced at the radiating fin by keeping the state that its viscosity is lowered due to the heat of the molded resin, the insulating resin penetrates into the inside of the hole; no air bubble is produced inside the insulating resin during a subsequent heating and hardening process; the insulating performance of a device can be improved.
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