METHOD AND APPARATUS FOR SOLDERING MULTILEADED ELECTRONIC COMPONENT,申请号JP19860259441-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR SOLDERING MULTILEADED ELECTRONIC COMPONENT
摘要
申请公布号	JPS63111695(A)	申请公布日期	1988.05.16
申请号	JP19860259441	申请日期	1986.10.29
申请人	EITEITSUKU TEKUTORON KK	发明人	YOKOTA HACHIJI
分类号	B23K33/00;B23K1/00;B23K1/14;B23K3/06;H05K3/34	主分类号	B23K33/00
代理机构		代理人
主权项
地址

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