| 摘要 |
PURPOSE:To totally eliminate the generation of dust and reduce damage to a semiconductor device to be machined and shaped by providing a mechanism for blowing a high pressure water stream for cutting or shaping said semiconductor device. CONSTITUTION:A semiconductor element 1 which is bonded to a reinforcing plate 2 of a metal, etc. is placed on a rotary table 3 in a dustless room. Then, a high pressure water stream 4 is blown toward this element 1 from a nozzle 5 to cut or shape the element 1 without generating dust. Thus, since there is no generation of dust, a semiconductor element manufacturing device can be used together with other devices in a high-grade dustless room, and the conveying process of the semiconductor element 1 can be omitted, increasing operation efficiency. |
