| 摘要 |
PURPOSE:To bond a substrate to a sample holding board with high parallelism by rolling a pressure roller while selecting its pressurizing pressure to be a pressure nearly proportionate to the length of a pressurizing line for said substrate. CONSTITUTION:A semiconductor substrate 4 is placed on a sample holding board 2 placed on a flat board 1, via a bonding material 3. Then, an elastic board 5 is placed on the substrate 4 and a pressure roller 6 is brought into pressure contact with an rolled on the elastic board 5. In this case, the pressurizing pressure P of the pressure roller 6 due to a pressure cylinder 7 is selected to be a pressure nearly proportionate to the length of the substrate 4 on the line of rolling contact in each rolling contact position of the pressure roller 6, i.e., the sum total of lengths that the lines of rolling contact cross the substrate 4. As a result, the bonding condition between the sample holding board 2 and the semiconductor substrate 4 can be made uniform, bonding the semiconductor substrate 4 to the sample holding board 2 with high parallelism. |
