| 摘要 |
PURPOSE:To prevent a malfunction from occurring at a semiconductor device by providing a heater which can heat a chip sealing resin to heat it. CONSTITUTION:A die pad 3 and a wire bonding pad 5 for placing a chip 6 are provided on a mounting substrate 1, and an electric heater 2 is wired through an insulating layer 9 under the pad 3. After a wire bonding is executed by wirings 7, they are sealed with resin. Since a voltage is applied to the heater 2 for use to heat a resin 8, absorbed moisture is dispersed to outer atmosphere. Accordingly, it can prevent a malfunction from occurring at a semiconductor device due to corrosion. |
