| 摘要 |
PURPOSE:To prevent the influence of the thermal expansion due to the heating of a conductor coil from being exerted on respective parts by providing a protecting film at a part of the gap tip side of a thin film magnetic head uppermost layer so as to set free the thermal expansion of an organic insulating material to a gap substrate side. CONSTITUTION:The heating due to the conducting to a conductor coil 5 occurs at a coil 5 part covered with a protecting film 11, and the heat is mainly conducted to the protecting film 11 and a nonmagnetic substrate 1. The stress added to the protecting film 11 is also in proportion to a film thickness, a gap base edge side is larger and the protecting film 11 is not film-formed to a gap base edge side from a combining part 6a of an upper part magnetic layer 6. Consequently, since the film comes to be an inclining surface and comes to be gradually thinner in the vicinity of the combining part 6a, it runs away and is absorbed to the part where the protecting film 11 is not formed. For this reason, the magnetic layer 6 is suppressed by the protecting film 11 adhered on the upper surface of the substrate 1 and it is prevented that the layer is protruded to a gap tip side. |
