| 摘要 |
PURPOSE:To prevent the lowering of moisture resistance due to the intrusion of water from a hanging pin by placing a semiconductor chip through an insulator extending over a plurality of leads extended from oppositely faced both sides. CONSTITUTION:The title semiconductor device is constituted including a plurality of leads 2, which are elongated toward the inside from oppositely faced both sides and take a shape that they are tangled mutually without contacts at a central section, and a semiconductor chip 1, which is placed through an insulator 3 extending over a plurality of the leads 2 at the central section and in which bonding-pads 5 and the noses of a plurality of the leads 2 are connected by metallic small-gage wires 4. Accordingly, an island section in which water is easy to intrude from a hanging pin is removed, and the length of the leads 2 is extended, thus improving moisture resistance.
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