Electroplating bath and process for maintaining plated alloy composition stable

摘要

A plating bath and process for electroplating coatings of palladium nickel alloys on a conductive substrate at current densities in the range of 10 amps/sq. ft. to 150 amps/sq. ft. wherein the palladium content of the alloy remains substantially constant despite current density variations during plating. The alloy composition stability is acheived by adding at least about 15 parts per million of iodide ions to the plating bath.