| 摘要 |
PURPOSE:To manufacture a multi-layer board efficiently by delivering a plurality of continuous prepregs, providing at least one layer of an inner layer circuit in the inner layer of said prepreg layer, piling continuous copper foils on at least one surface of the prepreg layers and heating and pressurizing the same while transferred. CONSTITUTION:Two layers of prepreg 4 are piled up on a core, on both faces of which two units of continuous copper foils 6 with both faces roughened are delivered, respectively specified inner layer circuits being formed together with reference holes by circuit punch press 7, 7'. One prepreg 4 is placed on the surface of the inner layer circuit, and continuous copper foils 8 are delivered and piled on both surfaces. Reference holes are provided in the copper foils 8 beforehand, and after the positions of respective reference holes are put together, the prepregs are guided into a continuous heat press 9, heated and pressurized. After being heated and pressure molded, the same are cut into fixed sizes according to the reference holes to complete the products. |
