| 摘要 |
PURPOSE:To stabilize the solder liquid surface in a dipping tank and to make satisfactory soldering with decreased foreign matter and splashes by allowing the molten solder in the dipping tank provided internally to a solder tank to overflow to the solder tank by means of a piston and valve, thereby circulating the solder. CONSTITUTION:The molten solder in the dipping tank 9 provided internally to the solder tank 6 is raised by opening the valve 10 against the energizing force of a spring 11 when said valve is pressed by a piston 12 actuated by a piston driving mechanism 17 so that the solder overflows safely and gently into a solder tank. A semiconductor device 18 is lowered to contact the overflow and the soldering is executed satisfactorily without the foreign matter and splashes. The valve 10 is closed and the valve 15 is opened by overcoming the energizing force of a spring 16 to suck the molten solder 7 in the solder tank 6 in the case of raising the piston 12.
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