| 摘要 |
PURPOSE:To be able to detect the displacement of a semiconductor circuit element by using an alignment pattern in which an alignment pattern including the detection of the displacement of the element is disposed on different semiconductor elements of a plurality of circuits on the same surface to align to expose it. CONSTITUTION:A semiconductor circuit element displacement detecting pattern 2 altered in a direction at each different semiconductor circuit element of a plurality of circuits on the same surface is provided on a conventional mask- displacement detecting alignment pattern 1 to form an alignment pattern. Then, when the alignment patterns (a), (b), (c), (d) on the alignment exposed mask 4 are different in the direction and shape of alignment patters a', b', c', d' on a wafer 5, the alignment exposure is judged that the displacement of the semiconductor circuit element occurs. Thus, the displacement of the circuit element can be detected. |
