| 摘要 |
PURPOSE:To use two leads linked via a chip mount base as independent external connection leads, by cutting a part of the chip mount base on which a photodetector chip is mounted, after mold forming. CONSTITUTION:Lead pieces 20A-20H are formed in a comb shape, and also, a lead frame being formed by linking between the lead pieces 20G and 20H at the chip mount base 21 on which an almost L shaped linking piece 21A is provided, is used. And the photodetector chip 10 is mounted on the chip mount base 21, and photodetecting parts 10A-10G are connected to the lead pieces 20A-20G through lead wires 11A-11G respectively, and the mold forming is performed with transparent plastic in the above state. After the mold forming, the lead frame 30, the lead pieces 20A-20G, and the linking piece 21A of the chip mount base 21 are cut. Thus, lead terminals 22A-22H are separated from the lead frame.
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