| 摘要 |
PURPOSE:To recognize a part of patterns and determine positioning by partitioning more than two elements into patterns having streets that are not in parallel with scribe lines, along which a wafer fo semiconductor is cut into chips. CONSTITUTION:More than two elements 2a and 2b which are formed into identical chips are respectively partitioned into patterns having streets 3 that are not in parallel with scribe lines X1, X2, Y1, Y2, along which a wafer 1 is cut into chips. If positions of the streets 3 are scanned by laser beams, a time required for scanning the streets 3 becomes larger than that required for scanning the positions of the scribe line Y1 and attenuation of reflecting light becomes smaller than that in the former case. Accordingly, the scribe lines Y1 and Y2 as well as the streets 3 are easily distinguishable by detecting the reflecting light from the wafer 1. Thus, a part of the patterns is recognized and alignment of the patterns is determined. |
