| 摘要 |
<p>PURPOSE:To make deburring easy, improve operation efficiency, and increase the corrosion resistance of a lead frame, by providing a lead part including a boundary between a lead part sealed in resin and an exposed part out of resin with a coating layer composed of tin or low melting point alloy containing tin. CONSTITUTION:A lead frame is formed by press-blanking of, for example, a copper alloy plate, and at the tip of an inner lead part 2, a partially plated part 6 of silver for example, is formed. Then, at the lead part putting a mold line 12, a silver system alloy layer 10 is arranged which has a composition of, for example 90% tin and 10% lead, and whose melting point is about 230 deg.C. A silicon semiconductor element 4 is joined to an element fixing part 3. The tip of the inner lead part 2 and the semiconductor element 4 are connected by wire bonding, and a mold area 8 is sealed with, for example, epoxy resin 7. An outer lead part 11 is subjected to a bending process, and a fusion solder plating layer is provided thereon. Thereby, deburring is facilitated without protruding of the seal resin out of a metal mold, and junction between the resin and the lead frame 1 is made complete.</p> |
