| 摘要 |
PURPOSE:To enable an ink to be splashed on the surface of a chip without scratching the chip by a method wherein, within an inker applicable to the inspection process of a semiconductor integrated circuit, an electrode is provided on a position between a semiconductor substrate and a dripping end of an ink well to impress the electrode and said dripping end of the ink well with voltage. CONSTITUTION:A cylindrical electrode 7 is provided to be connected to a plus power supply through an electric switch 8 in the end direction of an ink well 3 made of conductive material previously grounded. Probes 2 are brought into contact with an integrated circuit chip surface of a semiconductor substrate 1 and after finishing the inspection process, the switch 8 is closed to impress the electrode 7 with high voltage so that ink may be splashed on the chip surface by an electric field generated between the end of ink well 3 and the electrode 7. Through these procedures, the gap between the end of ink well 3 and the integrated circuit chip on the semiconductor substrate can be adjusted easily so that the ink may be splashed on the chip surface without scratching the chip.
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