| 摘要 |
A resinous product is disclosed provided with a surface coatable with a metal layer, the metal layer being bonded to the resinous product through an array of microdendrites embedded into the resinous product. Various resinous products having planar surfaces and objects of other geometric shapes having planar or non-planar surfaces, coated with strongly adhering metal layers by electroless deposition, can be provided in particular a double-sided planar board, in which printed circuits on opposing surfaces are interconnected integrally with through-hole plating. |
