| 摘要 |
<p>PURPOSE:To reduce generation of dust, and improve the manufacture yield of semiconductor integrated circuit parts, by a method wherein a float mounting a wafer carrier accommodating wafers is moved in a fluid flow path by a fluid driving power source, and halted in the vicinity of a manufacturing equip ment by a float stopper. CONSTITUTION:When a constant driving flow of pure water 4 is generated by a fluid driving power source 6, a float 3 moves in a fluid flow path 5. A wafer 1 to be treated is received in a vacant wafer carrier 2 in the float 3, which is halted by a float stopper 7a, when the float 3 reaches the vicinity of a manufacturing equipment 9a. When a detector of the stopper 7a detects the arrival of the float 3, the wafer carrier 2 is conveyed into the manufacturing equipment 9a from the float 3 by a manipulator 8a, and the wafer 1 is treated by the manufacturing equipment 9a. As individual pieces do not contact with each other, dust does not generate and the constitution is simple.</p> |
