| 摘要 |
The multi-layer board is constructed by laminating multiple of unit circuit boards, each having the same circuit pattern of a conducting layer (b1,b2,b3,b4) on an insulating layer (c1,c2,c3), and by covering the outer surface with solder plating (a1,a2). Each of the unit boards is made to a standard thickness using a conventional technique and then they are glued together. The conductive layers are brought into electrical contact via a through-hole (T), with or without a connection metal (J). |
