| 摘要 |
PURPOSE:To prevent aluminium wirings, etc., from corroding due to moisture permeation by a method wherein, during the bonding process of a semiconductor chip to a leadframe using a high molecular bonding agent or after finishing the bonding process using said high molecular bonding agent, said semiconductor chip and leadframe are exhausted during the wire bonding process. CONSTITUTION:A semiconductor chip 2 is bonded onto a leadframe 1 using a high molecular bonding agent 3 such as silver epoxy paste. The semiconductor chip 2 and the leadframes 1 are connected by wires 4. When the semiconductor chip 2 is bonded to the leadframe 1 using the high molecular bonding agent 3, any decomposing gas is exhausted satisfactorily. Through these procedures, aluminium wirings, etc., can be prevented from corroding due to moisture permeation. |
