发明名称 METHOD FOR REGENERATING AND UTILIZING ELECTROLESS PLATING SOLUTION
摘要 PURPOSE:To regenerate an electroless plating soln. when the specific gravity is increased during use, by introducing the plating soln. into a cooler so as to successively remove org. oily foreign matter and sodium sulfate. CONSTITUTION:When the specific gravity of an electroless plating soln. for forming a plated copper circuit on a wiring board is increased during use, the plating soln. is introduced into a cooler, where org. oily foreign matter extracted from the board during plating is first separated and removed. By- product sodium sulfate accumulated in the plating soln. is then crystallized and removed. The electroless plating soln. regenerated in the cooler at low temp. is poured into a tank contg. a plating soln. overflowed during operation to drop the temp. by <=about 5 deg.C. The resulting soln. is introduced into a plating tank after mixing with sodium hydroxide for adjusting the pH and formalin for increasing the activity. Thus, the spent electroless plating soln. can be regenerated and utilized.
申请公布号 JPS63103078(A) 申请公布日期 1988.05.07
申请号 JP19860246906 申请日期 1986.10.17
申请人 HITACHI CONDENSER CO LTD 发明人 UOZU NOBUO;MATSUDA YOICHI;ZAMA TSUTOMU
分类号 C23C18/40;C23C18/16 主分类号 C23C18/40
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