摘要 |
PURPOSE:To conveniently deposit a metal on a plastic substrate with good workability by producing a corona discharge on the plastic substrate, and then applying electroless plating. CONSTITUTION:Masking ink 2 and masking ink 4 contg. a metal 3 are partially printed on the plastic substrate 1, and corona discharge treatment 5 is carried out on the whole surface of the substrate 1. Consequently, an electric discharge wave 6 acts directly on the unprinted part of the surface of the substrate 1, acts weakly on the part of the ink 2, and does not act on the part of the ink 4. When the masking ink 2 and 4 are removed by a release agent and the substrate is dipped in an etchant 10, the etchant 10 deposits and remains on the surface of the part 9 having received the electric discharge wave 6, the etchant 10 is not deposited on the part 11 unaffected by the electric discharge wave 6, and the thickness of the etchant 10 depositing and remaining on the substrate differs in accordance with the intensity of the electric discharge wave 6. As a result, when the etchant 10 is removed and electroless plating is carried out, a thick metal film 12, a thin metal film 13, and the part 11 without a film are respectively formed. |