| 摘要 |
PURPOSE:To microstructuralize an image pickup device by a method wherein a light-emitting element is installed on a packaging substrate. CONSTITUTION:A light-emitting element 103 is built of a lower electrode 104, light-emitting layer 105, and an upper transparent electrode 106, and is formed on a packaging substrate 101. An insulating transparent substrate 107 and light- stopping layer 108 are composed of a metal such as Cr or Mo or of polycrystalline silicon or the like. Because a light-emitting element needs to be built on a packaging substrate (preferably an inexpensive glass substrate), an electroluminescence (EL) cell is built at a lower temperature for this purpose. A light source (light-emitting element), photoelectric transfer element (photodetecting element), and a scanner circuit are integrated into a reading system on one and the same packaging substrate. A lens system including a rod lens or the like may be omitted. |
