| 摘要 |
PURPOSE:To enhance the contact accuracy of a measuring pin with a measuring land, by a method wherein the same substrate as a printed wiring substrate to be measured is used as a jig substrate. CONSTITUTION:A copper foil 8 forming a predetermined pattern is provided to a printed wiring substrate 1 to be measured and parts 9 are mounted to said substrate 1 corresponding to said pattern and a measuring land 10 is formed to the pattern at a predetermined position and a test pin 7 is opposed to said land 10. Solder S is adhered to the part of the measuring land 10 on the printed wiring substrate 1 and the leading end of the test pin 7 is contacted with the surface of the solder S. A substrate having he same pattern as the printed wiring board 1 to be measured is used in a jig substrate 2 and a piercing hole 12 is formed to the part of the measuring land 10' in a copper foil 8' forming a pattern and a test pin body part 13 is inserted through said piercing hoe 12. The lead wire 14 piercing through a test pin unit 6 is connected to the test pin main body part 13 and a signal is inputted and outputted through the lead wire 14.
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