发明名称 LIQUID COOLING SYSTEM FOR INTEGRATED CIRCUITS
摘要 A liquid cooled circuit module comprises an integrated circuit package (43); a cover (40) having a rim (40d) which lies against the integrated circuit package (43), the cover (40) being shaped to form a passage for the liquid between the integrated circuit package (43) and the cover (40); a retaining mechanism (42), which is fastened directly to the integrated circuit package (43), and which includes a member (42a) that extends above the cover (40); and a spring (41), which is held in compression between the cover (40) and the retaining mechanism member (42); the spring (41) being adapted to press the rim (40d) against the integrated circuit package (43) with at least a predetermined minimal force which prevents leaks and at the same time not exceed a stress limit in the spring. In a second embodiment, a leak tolerant cooling system for cooling electrical components with a liquid comprises: a frame (10) holding a plurality of printed circuit boards (11), each of which have electrical components attached thereto; a top reservoir (14), mounted on the frame (10) above the boards, for holding the liquid at atmospheric pressure; a conduit (17a-17g) coupled to the top reservoir and the boards, for conveying the liquid in a downward direction from the top reservoir over the components, the conduit being airtight in the absence of a leak therein; a bottom reservoir (15), coupled to the conduit below the boards, for receiving the liquid plus any air due to leaks from the conduit, the bottom reservoir being airtight except for a valve (16) which opens in response to a valve control signal S2; a pump (19), coupled to the bottom reservoir, for sucking the liquid and air through the conduit at sub-atmospheric pressures in response to a pump control signal S1, and for simultaneously returning the liquid to the top reservoir; and a control circuit (25) for generating the pump control signal starting when the liquid in the bottom reservoir is at a predetermined high level and continuing until the liquid in the bottom reservoir drops to a predetermined low level due to air leaking into the conduit, and for generating the valve control signal as the complement of the pump control signal.
申请公布号 WO8802979(A3) 申请公布日期 1988.05.05
申请号 WO1987US02583 申请日期 1987.10.08
申请人 UNISYS CORPORATION 发明人 TUSTANIWSKJ, JERRY, IHOR;HALKOLA, KYLE, GEORGE
分类号 H01L23/34;H01L23/40;H01L23/46;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/34
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