发明名称 |
Printed circuit card fabrication process with nickel overplate. |
摘要 |
<p>In a process for making a printed circuit from an insulating substrate with a copper plated surface and plated through holes, the surface and through holes are plated with a thin nickel layer prior to further fabrication steps.</p> |
申请公布号 |
EP0265629(A2) |
申请公布日期 |
1988.05.04 |
申请号 |
EP19870112690 |
申请日期 |
1987.08.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAKOS, PETER;BALDAUF, LAWRENCE MARTIN;NAPP, DUANE THEODOR |
分类号 |
H05K1/09;H05K1/11;H05K3/06;H05K3/24;H05K3/38;H05K3/42 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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