发明名称 |
Method of soldering an integrated circuit and printed circuit board |
摘要 |
A method of soldering an integrated circuit with yielding connecting contacts rigidly mounted on the integrated circuits to printed circuit boards. The integrated circuit is inserted in a clamped manner into a formed opening in a printed circuit board and the connecting contacts are soldered with the conductors by means of customary soldering methods for mass production such as by wave soldering.
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申请公布号 |
US4741472(A) |
申请公布日期 |
1988.05.03 |
申请号 |
US19860890901 |
申请日期 |
1986.07.28 |
申请人 |
GRUNDIG E.M.V. ELEKTRO-MECHANISCHE VERSUCHSANSTALT MAX GRUNDIG |
发明人 |
BAERMANN, DIETER |
分类号 |
H05K1/18;H05K3/34;(IPC1-7):B23K31/00;B23K31/02 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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