发明名称 Method of soldering an integrated circuit and printed circuit board
摘要 A method of soldering an integrated circuit with yielding connecting contacts rigidly mounted on the integrated circuits to printed circuit boards. The integrated circuit is inserted in a clamped manner into a formed opening in a printed circuit board and the connecting contacts are soldered with the conductors by means of customary soldering methods for mass production such as by wave soldering.
申请公布号 US4741472(A) 申请公布日期 1988.05.03
申请号 US19860890901 申请日期 1986.07.28
申请人 GRUNDIG E.M.V. ELEKTRO-MECHANISCHE VERSUCHSANSTALT MAX GRUNDIG 发明人 BAERMANN, DIETER
分类号 H05K1/18;H05K3/34;(IPC1-7):B23K31/00;B23K31/02 主分类号 H05K1/18
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