Multichip package having outer and inner power supply means

摘要

For uniform distribution of power to integrated circuit chips arranged on a substrate, a multichip package comprises a plurality of power feed contact pads on an outer portion of the substrate for coupling to an external power source and a pair of power feed pins on an inner portion of the substrate for coupling to the external power source. A conductive means is provided on the substrate for distributing power from the power feed contact pads and the power feed pins to the integrated circuit chips.