| 摘要 |
PURPOSE:To uniformize the thickness of the deposited plated layer by providing a current shielding plate having an opening in parallel with and at a specified distance from an anode plate, piercing an auxiliary electrode rod with the conical upper end through the opening, and vertically providing the electrode rod on the anode plate to equalize the current densities to the lead pieces on the cathode side. CONSTITUTION:The current shielding plate 18 having an opening is provided in parallel with and at a specified distance from the anode plate 13 arranged at the bottom of the plating bath of the electroplating device 11, and the center of the opening is aligned with the center of an upper jig 15 for mounting a material to be plated. The auxiliary electrode 17 with the conical upper end is pierced through the opening and vertically and electrically connected to the anode plate 12, and the distance between the lower end of many lead pieces 16 fixed to the mounting jig 15 and the auxiliary electrode rod 17 is controlled to about 20mm. When a voltage is impressed between the anode plate 13 and a bus bar 14 under such a structure, the current flowing from the anode plate 13 to the lead pieces 16 is offset by the auxiliary electrode rod 17, the current densities supplied to the lead pieces 16 are practically equalized, and the thickness of the plated layer deposited on the lead pieces 16 is uniformized.
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