| 摘要 |
PURPOSE:To constitute a large scale system without decreasing reliability, by a constitution wherein the side surface of one of semiconductor chips, which are mounted to first wiring boards, is brought into contact with the surface of a second wiring board. CONSTITUTION:When semiconductor chips 1 are mounted on first wiring boards 2 through a bumps 5a in a semiconductor device, at least one chip is mounted at a position, where the side surface 1a of the chip is brought into contact with the surface of a board 3. The side surface of each first wiring board 2 is fixed to the side of the second wiring board 3. When a force is applied from the surface of the first wiring board 2, a force applying point is a central electrode 5b and a supporting point lies at the tangent line between the rear surface of the first wiring board 2 and the main surface of the second wiring board 3. Conversely, when a force is applied from the rear surface, the force applying point is the same, and the supporting point lies at the tangent line between the rear surface of the semiconductor chip 1 and the surface of the second wiring board 3. Since the thickness of the semiconductor chip 1 and the thickness of the first wiring board 2 are about the same, the mechanical connecting strength at the same degree is obtained. Therefore, the number of the signal terminals of the subsystem of the first wiring board can be increased. Thus a large scale system can be fabricated in a three-dimensional multiple-chip package. |
