| 摘要 |
PURPOSE:To measure internal boosted voltage by fitting a terminal for measuring voltage boosted on the inside to an index section by using an inner lead for a lead frame. CONSTITUTION:One inner lead is increased in addition to normal inner leads so as to be able to monitor VPP while being adjoined to a tab-hanging lead 5 supporting a tab 4, on which a semiconductor chip is mounted, in the inner lead 3. The inner lead 3 is fitted while side-ways displacing one part of the tab-hanging lead. A large number of electrode sections for leading out internal wirings for the semiconductor chip to the outside the disposed around the chip, and one part of the bonding pad section is formed as a VPP terminal, and an output from an internal boosting circuit is connected to the VPP terminal. The bonding pad and the lead 3 are connected by an Al wire, etc. |
