发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition with the components mutually blended in good compatibility, thus giving high strength/high rigidity at elevated temperatures and outstanding impact resistance, by incorporating a specific silane derivative compound in a composition comprising a semiaromatic polyamide, aliphatic polyamide and aromatic polyether resin. CONSTITUTION:The objective composition can be obtained by incorporating (A)100pts.wt. of a resin composition comprising (i) 20-80wt% of an aliphatic polyamide from aliphatic diamine and aliphatic dicarboxylic acid, (ii) 0.5-30wt% of a semiaromatic polyamide from aliphatic diamine and aromatic dicarboxylic acid, and (ii) 20-70wt% of an aromatic polyether resin with (B) 0.05-5pts.wt. of a silane derivative compound with at least one alkoxy or acetoxyl group directly bonded to the silicon atom, also having at least one functional group (not directly bonded to the silicon atom) selected from chloro, epoxy, amide, ureide, methacryloxy, isocyanate, carboxyl and hydroxyl groups.
申请公布号 JPS6395262(A) 申请公布日期 1988.04.26
申请号 JP19860239252 申请日期 1986.10.09
申请人 ASAHI CHEM IND CO LTD 发明人 MURAKAMI ATSUSHI;YAKABE SADAYUKI
分类号 C08K5/00;C08K5/54;C08K5/5419;C08K7/14;C08L71/08;C08L71/12;C08L77/00;C08L77/06 主分类号 C08K5/00
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