发明名称 RESIN SEALING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To carry out resin sealing under the same condition of molding and ensure a uniform package molding by measuring the degree of vacuum in a template on the occasion of causing a plunger to advance, thereby controlling a starting time of the plunger according to the measured value. CONSTITUTION:The insides of templates 21 and 27 are vacuum-exhausted by placing resin tablets into a transfer pot in the template 21 and also by using a suction system 25 and after that, the resin tablets are pressure-fed into cavities 23 and 29 by causing a plunger 26 to move forward to perform a resin sealing. In such a case, on the occasion of making the plunger 26 move forward, the degrees of vacuum in the templates 21 and 27 are measured by a vacuum gauge 24 a starting time of the plunger 26 is controlled according to the measured values. Under these situation, once the inside of the template comes to a prescribed vacuum state, this device permits the plunger 26 to move forward and the resin tablets to be fed under pressure in the cavities 23 and 29.
申请公布号 JPS6395635(A) 申请公布日期 1988.04.26
申请号 JP19860241678 申请日期 1986.10.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA SUEKICHI;TSUTSUMI KOJI;MORITA YUTAKA
分类号 B29C45/02;B29B11/12;B29B11/14;B29C37/00;B29C43/00;B29C43/56;B29C45/14;B29C45/34;B29C45/76;B29L31/34;H01L21/56 主分类号 B29C45/02
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