Method of treating wafers with fluid

摘要

Disclosed is apparatus for treating semiconductor wafers with fluids. The device comprises a plurality of vessel segments having lateral walls for enclosing the wafers defining open ends. Sealing structure is provided at the ends so that the segments may be serially nested together and engaged with a fluid inlet and a fluid outlet in a wafer treatment fluid flow line. The vessel segments are constructed of material that is inert to the treatment fluids and designed to minimize creation of eddy currents and fluid traps. Fluid flowing through the vessel uniformly contacts the wafers and results in improved and more reproducible pre-diffusion cleaning, rinsing, etc.