| 摘要 |
PURPOSE:To remove the defective assembly of a short circuit, etc., and to dissipate heat generation in a light-emitting section efficiently by bonding a semiconductor laser chip with a heat sink on the light-emitting section side main surface of the chip and on the reverse side main surface and mounting a radiator plate onto the light-emitting section side main surface, in contact with the surface of the heat sink. CONSTITUTION:The greater part of heat generated in a light-emitting section 2 pass through an upper ohmic electrode, and transmitted over a heat sink 3 through a radiator plate 4 consisting of a conductive material such as Mo, one part of residual heat escapes into air, and the other passes in a semiconductor laser chip 1 and flows through the heat sink 3 in a lower section, thus effectively dissipating the heat generation of the light-emitting section to the outside. A defective short-circuit on assembly can be removed by assembling the title device through a junction up method. |
