| 摘要 |
PURPOSE:To render an LSI packageable without using an LSI package by a method wherein conductive pattern portions corresponding to LSI pad positions are electrically connected to LSI chip pads, the periphery is electrically connected to a corresponding pattern on a printed board, and then the LSI chip is fixed immovable to the printed board. CONSTITUTION:A film 1 is larger than an LSI chip 3 and, on its rear surface, there radiates a printed conductive pattern 2. Padding lands 2A are provided on the LSI chip 3 at positions corresponding to pad positions thereon, and lands 2B for the printed board pattern are provided on the conductive pattern 2 at positions corresponding to a pattern 4 of a printed board 5. padding lands 2A are exposed to an ultrasonic pressure applied from above the film 1, whereby electrical connection is established with the pads of the LSI chip 3. The lands 2B of the pattern 4 of the printed board 5 are allowed to adhere to the pattern 4 for the establishment of electrical connection by means of an adhesive means 6 on the rear surface of the film 1. The LSI chip 3 is covered by the film 1 and then fixed mechanically tight to the printed board 5.
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