发明名称 BONDING SYSTEM
摘要 PURPOSE:To reduce any failure in recognition for increasing the number of controllable bonding systems by only one operator by a method wherein multiple numbers of automatic bonding systems are equipped with one picture image recognition supporter playing an efficient role in picture image recognition. CONSTITUTION:Multiple automatic bonders 1a-1n that perform wire-bonding of an LED chip 20 fixed onto a lead 21 pick up the image of chip 20 by means of a camera 7 to express it in a binary-coded form by means of a picture image reader 9. A computer 10 decides a bonding position on the basis of the picture image data to control a tool 8 and a stage 6. A picture image recognition supporter 4 successively transfers a switched 19a-19n of a converter to monitor the status of bonders 1a-1n. When the bonder 1a fails to recognize the picture image, a corresponding switch 16a is connected. Simultaneously, the data from camera 7 are inputted to a picture image pickup device 12 to be multiple-coding or turned into colored picture image data for deciding the bonding position by another computer 13. Finally, this positional data are transferred to the computer 10 of bonder 1a.
申请公布号 JPS6393120(A) 申请公布日期 1988.04.23
申请号 JP19860239691 申请日期 1986.10.08
申请人 SANKEN ELECTRIC CO LTD 发明人 OTSUKA KOJI;SUZUKI TAKASHI;MUGISHIMA YOSHIAKI
分类号 H01L21/52;G06T1/00;H01L21/60 主分类号 H01L21/52
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