| 摘要 |
PURPOSE:To perform the dicing process neither doing any damage nor bonding any foreign matters to a wafer by a method wherein the levels of wafer holding parts and dicing tape holding parts are differentiated with one another while a means of vacuumizing the space formed by a wafer and a dicing tape is provided. CONSTITUTION:Circular holding parts with triangular section are formed in an intermediate part on the surface of a whole jig main body 1 formed on a disc. Besides, the other circular holding parts 3 with triangular section higher than the holding parts 2 are formed outside the holding parts 2 of main body 1. Furthermore, a communicating channel 4 is cut to be opened between the holding parts 2 and 3. Then, a wafer W with back surface thereof looking downward is mounted on the holding parts 2 by receiving grooves 2a formed on the upper parts of the same 2 and then a dicing tape T with bonding surface thereof looking downward is mounted on the holding parts 3. Finally, the space between the wafer W and the tape T is vacuumized for pressure reduction to bond to tape T onto the wafer W. |
