| 摘要 |
PURPOSE:To check IC mounted height down to low as well as to make this fluorescent character display tube into the integration of CIG (Chip in Glass) by a space factor identical to the general display tube, by mounting an integrated circuit element on a substrate by means of a TAB (Tape Automated Bonding) process, and also mounting it the underside of a frame electrode group. CONSTITUTION:On a glass substrate 1, there are provided with a segment electrode 4 having a phosphor layer, a drive circuit IC chip 11 and a pad part 5 consisting of a silver thick film to be electrically connected by means of a TAB process. This IC chip 11 is mounted by such a face-down process as making a circuit surface come to the side of the substrate 1. And, a tape is provided with a bump at and end of a copper lead by means of an etching technique, and further gilded. This tape 12 is thermocompressionally bonded to the pad part of the chip 11 by a TAB bonder. In addition, the chip 11 is set up where it is situated in the downside of a frame supporter 80 supporting a grid electrode 8, and this supporter 80 serves as a shield in combination.
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