发明名称 SOLDERING DEVICE
摘要 PURPOSE:To feed a molten solder even in narrow gap and to prevent the generation of a defective soldering by jetting a molten solder from a turbulent flow forming cylinder by a pressurizing means, making the wavehead in turbulence state and fluctuating the wavehead and down, and the right and left. CONSTITUTION:Nozzles 5 and 5' are provided in parallel inside a solder tank 4', the nozzle 5' is made in a trapezoidal section with its lower part being expanded and numerous cylindrical turbulent wave forming cylinders 6, 6... are provided. A molten solder is stored in the solder tank 4' and when it is jetted from the nozzles 5 and 5' by actuating an impeller, the nozzle 5' jets a wavy molten solder. The printed board temporarily fixing a chip part is brought into contact with the molten solder of the nozzle 5' and then of the nozzle 5. The wavehead of the wave of the molten solder thus comes between the chip parts, the sealed gas or air is exhausted and the molten solder wets the sealed gas or air is exhausted and the molten solder wets the respective electrode of a copper foil and chip part as well. In this case, the wavehead fluctuates vertically and on right and left, so good wet is performed by intruding to the site from which a gas or air is escaped.
申请公布号 JPS6393469(A) 申请公布日期 1988.04.23
申请号 JP19870200058 申请日期 1987.08.12
申请人 ISHII GINYA;MIYANO YOSHIHIRO 发明人 ISHII GINYA;MIYANO YOSHIHIRO
分类号 B23K1/08;B23K3/06;H05K3/34 主分类号 B23K1/08
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