| 摘要 |
PURPOSE:To prevent the generation of poor reverse withstanding voltage, by using a lead electrode having a plurality of projections, which are thinner than the thickness of a header part and are protruded from a semiconductor chip. CONSTITUTION:A semiconductor chip 2 and a lead electrode 3 are fixed to a recessed metal substrate 1 with a solder 4. An insulating resin 5 is injected in the substrate 1 after the exposed part of the P-N junction of the chip 2 is cleaned, and the resin is hardened. The exposed part is covered with the resin. Projection parts 3a are provided on a header part 3b from place to place. The projection part 3a is narrow and thin. The resin flows well and voids are not formed. |
