| 摘要 |
The curable organopolysiloxane composition is curable by heating at a relatively low temperature of, for example, 120 DEG C. into a silicone rubber which exhibits outstandingly high adhesive bonding strength to the substrate surface on which it has been cured. The composition is formulated with (A) a trivinylsilyl-terminated diorganopolysiloxane, (B) an organohydrogenpolysiloxane as the crosslinking agent, (C) a preferably cyclic organopolysiloxane having two silicon-bonded hydrogen atoms and at least one hydrolyzable group, e.g. methoxy, or oxirane-containing group, e.g. glycidyl, in a molecule and (D) a platinum compound as a catalyst to promote the hydrosilation reaction between the vinyl groups in (A) and the silicon-bonded hydrogen atoms in (B).
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