| 摘要 |
A header has three throughpins supported by glass insulating regions in the header wall having inside and outside portions. A releasable terminal formed with a central opening is soldered to each inside portion of a throughpin and is formed with a groove that carries a lock washer or C-clip that stops a spring in compression stopped at the other end by an epoxy layer adjacent to the inside of the header wall. The assembly is formed by inserting throughpins through the openings, baking the glass insulators at 2000 DEG F., cooling this assembly, soldering the releasable pins to the inside portions at a temperature of substantially 700 DEG F. and allowed to cool. The epoxy layer is then applied at a temperature of the order of 500 DEG F. and then allowed to cool. A coil spring is then inserted over each releasable pin, compressed, a C-clip or lock washer located in the releasable pin groove, and the spring released to engage the C-clip or lock washer while in compression between the epoxy and lock washer or C-clip.
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