| 摘要 |
PURPOSE:To block the flow of solder and to omit a die pad sinking device, by arranging a solder-flow stopping means at a part of a suspending lead in the vicinity of a die pad, with the die pad and the suspending lead being located at the same height. CONSTITUTION:A lead frame 4 is constituted of the following parts: an inner lead 4a; a die pad 4b, which is located at the same height as the inner lead 4a; a suspending lead 4c, which supports the die pad 4b; V-shaped notches 4d; which are formed at a part of the suspending lead 4c in the vicinity of the die pad 4b when the lead frame 4 is punched ; and the like. The flow of a solder 3, when a die 2 is bonded on the die pad 4b through the solder 3, is blocked with the V shaped notches 4d. Since the solder-flow stopping means is arranged in the vicinity of the die pad 4b with the die pad 4b and the suspending lead 4c being located at the same height, sinking of the die pad in a line is not required.
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