| 摘要 |
A process for filling vias in a sheet of dielectric tape for use in fabricating hybrid multilayer circuit structures. The process includes the steps of securing a sheet of dielectric tape (11) comprising a dielectric layer and a supporting carrier layer to a frame (13), forming vias (19) in the dielectric tape, securing the frame with the dielectric tape to a via filling fixture (17), filling the vias with via fill metallization, and removing the dielectric tape from the via filling fixture. The process further contemplates filling vias of dielectric tape secured directly to an exposed surface of a hybrid circuit during the manufacturing process. |
