| 摘要 |
PURPOSE:To obtain a circuit board capable of collecting light from a light-emitting element with a high efficiency, by forming a metallic layer on the upper or lower recessed surface of a resin layer filling a through hole in a metallic base circuit board before packaging the light-emitting element thereon. CONSTITUTION:A metallic base circuit board is obtained by laminating a metallic foil integrally on the top or rear face of a metallic plate 1 having a through hole at a required position, with a resin layer 2 interposed between the metallic foil and the metallic plate 1 and by forming a circuit pattern 3 thereon. After a metallic layer 5 is formed on the upper or lower recessed surface of the resin layer filling the through hole 4, a light-emitting element 6 is packaged on the metallic layer 5. For example, a metallic base circuit board is obtained by laminating a copper foil on the top face of a 1 mm thick silicon steel plate 1 including a through hole having a diameter of 10 mm at a required position, while two sheets of glass cloth soaked with epoxy resin and having a thickness of 0.1 mm are interposed between the copper foil and the plate 1. The board is then etched to provide a circuit pattern 3. The upper recessed surface of the resin filling the through hole 4 is plated with gold 5. A light-emitting element 6 is packaged thereon by means of a die bonding paste 7 and bonded wires 8, so that a metallic base circuit base is obtained. |
